Packaging of High Power Semiconductor Lasers

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Packaging of High Power Semiconductor Lasers

von

Liu, XingshengLiu, HuiXiong, LinglingZhao, Wei

BuchGebunden

CHF208.00

Beschreibung

This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.

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Details

ISBN/GTIN978-1-4614-9262-7

ProduktartBuch

EinbandGebunden

Verlag

Springer New York

Erscheinungsdatum15.07.2014

Auflage2015

ReiheMicro- and Opto-Electronic Materials, Structures, and Systems

Seiten420 Seiten

SpracheEnglisch

MasseBreite 160 mm, Höhe 241 mm, Dicke 29 mm

Gewicht793 g

Artikel-Nr.1913657

Verlagsartikel-Nr.86304627

KatalogBuchzentrum

Datenquelle-Nr.15286607

Weitere Details

Reihe

Sapphire

Moisture Sensitivity of Plastic Packages of IC Devices

Packaging of High Power Semiconductor Lasers

Polymer and Photonic Materials Towards Biomedical Breakthroughs

Autor

Liu, XingshengLiu, HuiXiong, LinglingZhao, Wei

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi´an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.